发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME
- 专利标题（中）： 半导体器件和电子设备，包括它们
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申请号： US13285132申请日： 2011-10-31
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公开(公告)号： US20120043665A1公开(公告)日： 2012-02-23
- 发明人: Takahiro NAKANO
- 申请人： Takahiro NAKANO
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2009-118075 20090514
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device according to the present invention is a semiconductor device that includes: a semiconductor substrate having metal wiring formed on a bottom surface of the semiconductor substrate; and a plurality of wiring layers formed above the semiconductor substrate. The wiring layers include a first wiring layer and a second wiring layer that is formed above the first wiring layer. The semiconductor device further includes: a first through electrode which electrically connects the first wiring layer and the metal wiring; a second through electrode which electrically connects the second wiring layer and the metal wiring; and at least one layer difference adjustment film formed between the semiconductor substrate and the wiring layers. The at least one layer difference adjustment film includes a layer difference adjustment film formed on a region excluding a region corresponding to the second through electrode.
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