Invention Application
US20120044648A1 FIXING MECHANISM FOR FIXING A THERMAL MODULE ON A BASE AND RELATED ELECTRONIC DEVICE
有权
用于固定基板和相关电子设备上的热模块的固定机构
- Patent Title: FIXING MECHANISM FOR FIXING A THERMAL MODULE ON A BASE AND RELATED ELECTRONIC DEVICE
- Patent Title (中): 用于固定基板和相关电子设备上的热模块的固定机构
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Application No.: US12910842Application Date: 2010-10-24
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Publication No.: US20120044648A1Publication Date: 2012-02-23
- Inventor: Lin-Yu Lee , Shang-Chih Yang
- Applicant: Lin-Yu Lee , Shang-Chih Yang
- Priority: TW099216110 20100820
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component.
Public/Granted literature
- US08437137B2 Fixing mechanism for fixing a thermal module on a base and related electronic device Public/Granted day:2013-05-07
Information query
