发明申请
- 专利标题： SEMICONDUCTOR PACKAGE
- 专利标题（中）： 半导体封装
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申请号： US13189157申请日： 2011-07-22
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公开(公告)号： US20120049365A1公开(公告)日： 2012-03-01
- 发明人: Jun-young Ko , Jae-yong Park
- 申请人： Jun-young Ko , Jae-yong Park
- 优先权： KR10-2010-0082586 20100825
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/485
摘要：
A semiconductor package is provided. The semiconductor package includes a package substrate, a plurality of semiconductor chips, and a plurality of connection terminals. The package substrate includes a center portion, which has a first recess with a portion of a top of the package substrate removed, and an edge portion that has a plurality of second recesses. Each second recess has a portion of a bottom of the package substrate removed. The plurality of semiconductor chips are mounted in the first recess, and the plurality of connection terminals are respectively disposed in the second recesses.
公开/授权文献
- US08482133B2 Semiconductor package 公开/授权日：2013-07-09
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