Invention Application
- Patent Title: Thermal head, thermal printer and manufacturing method for the thermal head
- Patent Title (中): 热敏头，热敏打印机和热头的制造方法
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Application No.: US13136005Application Date: 2011-07-20
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Publication No.: US20120050447A1Publication Date: 2012-03-01
- Inventor: Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant: Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Norimitsu Sanbongi
- Priority: JP2010-188155 20100825
- Main IPC: B41J2/335
- IPC: B41J2/335 ; H05K13/00
Abstract:
A thermal head includes a substrate main body having a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state. A heating resistor is formed on a surface of the upper substrate, and a pair of electrodes connected to both ends of the heating resistor, respectively, for supplying power to the heating resistor. The substrate main body includes a cavity portion in a region opposed to the heating resistor at a bonding portion between the support substrate and the upper substrate, and at least one of the electrodes includes a thin portion in a region opposed to the cavity portion, the thin portion being thinner than other regions of the electrodes.
Public/Granted literature
- US08477166B2 Thermal head, thermal printer and manufacturing method for the thermal head Public/Granted day:2013-07-02
Information query
IPC分类:
