Invention Application
- Patent Title: LED PACKAGE
- Patent Title (中): LED封装
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Application No.: US13069393Application Date: 2011-03-23
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Publication No.: US20120056233A1Publication Date: 2012-03-08
- Inventor: TZU-CHIEN HUNG , CHIA-HUI SHEN
- Applicant: TZU-CHIEN HUNG , CHIA-HUI SHEN
- Applicant Address: TW Hsinchu Hsien
- Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- Current Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- Current Assignee Address: TW Hsinchu Hsien
- Priority: CN201010272003.2 20100908
- Main IPC: H01L33/48
- IPC: H01L33/48
Abstract:
An LED package includes a base, an LED chip and an encapsulation. The LED chip is mounted on the base. The encapsulation encapsulates the LED chip. A heat dissipating plate is sandwiched between the LED chip and the base. The heat dissipating plate includes a first surface and a second surface. The LED chip is mounted on the first surface of the heat dissipating plate and has an interface engaging with the first surface of the heat dissipating plate. The first surface of the heat dissipating plate has an area greater than that of the interface. The second surface of the heat dissipating plate is attached to the base.
Public/Granted literature
- US08258540B2 LED package Public/Granted day:2012-09-04
Information query
IPC分类:
