Invention Application
- Patent Title: MULTICOMPONENT SACRIFICIAL STRUCTURE
- Patent Title (中): 多元化的结构
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Application No.: US12680550Application Date: 2007-09-28
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Publication No.: US20120057216A1Publication Date: 2012-03-08
- Inventor: Lucio Flores , Lior Kogut , Xiaoming Yan , Thanh Tu , Qi Luo , Brian J. Gally , Dana Chase , Gang Xu , Sheng-Tzung Huang , Chia Wei Yang , Yi Fan Su
- Applicant: Lucio Flores , Lior Kogut , Xiaoming Yan , Thanh Tu , Qi Luo , Brian J. Gally , Dana Chase , Gang Xu , Sheng-Tzung Huang , Chia Wei Yang , Yi Fan Su
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS TECHNOLOGIES, INC.
- Current Assignee: QUALCOMM MEMS TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Diego
- International Application: PCT/US2007/020922 WO 20070928
- Main IPC: G02B26/00
- IPC: G02B26/00 ; C23F1/02
Abstract:
A MEMS comprising a sacrificial structure, which comprises a faster etching portion and a slower etching portion, exhibits reduced damage to structural features when in forming a cavity in the MEMS by etching away the sacrificial structure. The differential etching rates mechanically decouple structural layers, thereby reducing stresses in the device during the etching process. Methods and systems are also provided.
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