Invention Application
- Patent Title: METHOD AND APPARATUS FOR TEMPERING MATERIAL
- Patent Title (中): 温度材料的方法和装置
-
Application No.: US13320795Application Date: 2010-06-15
-
Publication No.: US20120060536A1Publication Date: 2012-03-15
- Inventor: Sampo Ahonen , Reijo Karvinen , Tommi Vainio
- Applicant: Sampo Ahonen , Reijo Karvinen , Tommi Vainio
- Applicant Address: FI VANTAA
- Assignee: BENEQ OY
- Current Assignee: BENEQ OY
- Current Assignee Address: FI VANTAA
- Priority: FI20095695 20090618
- International Application: PCT/FI10/50499 WO 20100615
- Main IPC: F28D5/00
- IPC: F28D5/00

Abstract:
A method and apparatus for tempering material is provided. One or more liquids are atomized by at least one sprayer into droplets which are guided towards a surface of a hot material so that at least some of the droplets collide with the surface of the hot material and evaporate, thus removing thermal energy from the surface layer of the hot material. Impact members may be used to further reduce the size of the droplets. The droplets may be guided to the surface by a separate guiding gas flow.
Information query