发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有膜片封装的集成电路封装系统及其制造方法
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申请号： US12882067申请日： 2010-09-14
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公开(公告)号： US20120061855A1公开(公告)日： 2012-03-15
- 发明人: Byung Tai Do , Linda Pei Ee Chua , Reza Argenty Pagaila
- 申请人： Byung Tai Do , Linda Pei Ee Chua , Reza Argenty Pagaila
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive.
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