发明申请
- 专利标题： SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG
- 专利标题（中）： 半导体封装与集成基板热液
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申请号： US12879795申请日： 2010-09-10
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公开(公告)号： US20120063096A1公开(公告)日： 2012-03-15
- 发明人: Andrew V. Kearney , Peng Su
- 申请人： Andrew V. Kearney , Peng Su
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L21/50
摘要：
To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.