发明申请
- 专利标题： CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- 专利标题（中）： 电路板和半导体模块，包括它们
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申请号： US13198224申请日： 2011-08-04
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公开(公告)号： US20120063108A1公开(公告)日： 2012-03-15
- 发明人: Yonghoon Kim , Hyunki Kim , Heeseok Lee
- 申请人： Yonghoon Kim , Hyunki Kim , Heeseok Lee
- 优先权： KR10-2010-0089045 20100910
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K1/02
摘要：
In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes.
公开/授权文献
- US08743560B2 Circuit board and semiconductor module including the same 公开/授权日：2014-06-03
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