发明申请
- 专利标题： HEAT-EXPANDABLE MICROSPHERES AND A METHOD OF MAKING HEAT-EXPANDABLE MICROSPHERES AND APPLICATION THEREOF
- 专利标题（中）： 热膨胀微晶及其制备方法及其应用
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申请号： US13321581申请日： 2010-05-21
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公开(公告)号： US20120064347A1公开(公告)日： 2012-03-15
- 发明人: Yu Kita , Katsushi Miki
- 申请人： Yu Kita , Katsushi Miki
- 申请人地址： JP Yao-shi, Osaka
- 专利权人： MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 当前专利权人： MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 当前专利权人地址： JP Yao-shi, Osaka
- 优先权： JP2009-138522 20090609; JP2009-197754 20090828
- 国际申请： PCT/JP2010/058583 WO 20100521
- 主分类号： B32B15/02
- IPC分类号： B32B15/02 ; B05D1/02 ; B05D5/00 ; B05D7/02
摘要：
Heat-expandable microspheres having high heat resistance and high solvent resistance, a production process thereof include a shell of a thermoplastic resin and a thermally vaporizable blowing agent being encapsulated therein. The thermoplastic resin includes a copolymer produced by polymerizing a polymerizable component containing a carboxyl-group-containing monomer. The surface of the heat-expandable microspheres is treated with an organic compound containing a metal of the Groups from 3 to 12 in the Periodic Table.
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