发明申请
- 专利标题： COPPER BONDING COMPATIBLE BOND PAD STRUCTURE AND METHOD
- 专利标题（中）： 铜结合兼容粘结板结构与方法
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申请号： US13298455申请日： 2011-11-17
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公开(公告)号： US20120064711A1公开(公告)日： 2012-03-15
- 发明人: François Hébert , Arup Bhalia
- 申请人： François Hébert , Arup Bhalia
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.
公开/授权文献
- US08753972B2 Copper bonding compatible bond pad structure and method 公开/授权日：2014-06-17
信息查询
IPC分类:
