Invention Application
US20120065703A1 Conductive Biopolymer Implant For Enhancing Tissue Repair And Regeneration Using Electromagnetic Fields
审中-公开
导电生物聚合物植入物用于增强使用电磁场的组织修复和再生
- Patent Title: Conductive Biopolymer Implant For Enhancing Tissue Repair And Regeneration Using Electromagnetic Fields
- Patent Title (中): 导电生物聚合物植入物用于增强使用电磁场的组织修复和再生
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Application No.: US13184313Application Date: 2011-07-15
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Publication No.: US20120065703A1Publication Date: 2012-03-15
- Inventor: Michael Paukshto , George Martin , John Cooke
- Applicant: Michael Paukshto , George Martin , John Cooke
- Applicant Address: US CA Sunnyvale
- Assignee: Fibralign Corporation
- Current Assignee: Fibralign Corporation
- Current Assignee Address: US CA Sunnyvale
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
Embodiments of the present invention relate generally to the field of tissue repair and regeneration. More specifically, embodiments of the present invention relate to medical devices, materials or constructs, such as conductive biocompatible polymers having one or more networks of metal nanowires that enhance tissue repair and regeneration using electromagnetic fields.
Public/Granted literature
- US10065046B2 Conductive biopolymer implant for enhancing tissue repair and regeneration using electromagnetic fields Public/Granted day:2018-09-04
Information query
