Invention Application
- Patent Title: METHOD OF MANAGING PROCESS FACTORS THAT INFLUENCE ELECTRICAL PROPERTIES OF PRINTED CIRCUIT BOARDS
- Patent Title (中): 影响印刷电路板电气性能的过程因素管理方法
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Application No.: US13092966Application Date: 2011-04-24
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Publication No.: US20120066660A1Publication Date: 2012-03-15
- Inventor: HSIAO-YUN SU , YING-TSO LAI , CHENG-HSIEN LEE
- Applicant: HSIAO-YUN SU , YING-TSO LAI , CHENG-HSIEN LEE
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: TW99130514 20100909
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In a method of managing process factors that influence electrical properties of printed circuit boards (PCBs), n process factors are arranged in an order according to different influence to one kind of electrical property of the PCBs. The different influence is determined by first experiments designed using the Taguchi method. M process factors that have important influence to the electrical property are obtained from the n process factors according to the order to design second experiments. A computing formula for the electrical property is fitted using the m process factors according to simulated results of the second experiments, and a variation range of each of the m process factors is computed according to the computing formula.
Public/Granted literature
- US08341587B2 Method of managing process factors that influence electrical properties of printed circuit boards Public/Granted day:2012-12-25
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