发明申请
US20120067631A1 INSULATING CIRCUIT BOARD, INVERTER DEVICE AND POWER SEMICONDUCTOR DEVICE
审中-公开
绝缘电路板,逆变器器件和功率半导体器件
- 专利标题: INSULATING CIRCUIT BOARD, INVERTER DEVICE AND POWER SEMICONDUCTOR DEVICE
- 专利标题(中): 绝缘电路板,逆变器器件和功率半导体器件
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申请号: US13148668申请日: 2010-02-05
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公开(公告)号: US20120067631A1公开(公告)日: 2012-03-22
- 发明人: Junpei Kusukawa , Hironori Matsumoto
- 申请人: Junpei Kusukawa , Hironori Matsumoto
- 优先权: JP2009-028388 20090210
- 国际申请: PCT/JP2010/051668 WO 20100205
- 主分类号: H05K1/02
- IPC分类号: H05K1/02
摘要:
An object of the invention is to provide an insulation circuit board with high insulation reliability and a related technology that uses this insulation circuit board. An insulation circuit board (12) according to the invention includes: a metal base plate (1); an insulation layer (2); and a conductive circuit (4) formed on the metal base plate (1), with the insulation layer (2) therebetween, wherein the insulation layer (2) is formed by lamination of a plurality of layers that includes at least: a composite insulation layer (2a) that forms a surface boundary with the conductive circuit (4) and includes an inorganic filler (8) dispersed in an insulation plastic (7); and a simple plastic insulation layer (2b) that includes no inorganic filler (8).