发明申请
- 专利标题: CHIP TO DIELECTRIC WAVEGUIDE INTERFACE FOR SUB-MILLIMETER WAVE COMMUNICATIONS LINK
- 专利标题(中): 切割到用于亚微波通信的电介质波导接口
-
申请号: US12887323申请日: 2010-09-21
-
公开(公告)号: US20120068891A1公开(公告)日: 2012-03-22
- 发明人: Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
- 申请人: Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
- 申请人地址: US TX Dallas
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 当前专利权人地址: US TX Dallas
- 主分类号: H01Q1/24
- IPC分类号: H01Q1/24
摘要:
In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
公开/授权文献
信息查询