Invention Application
US20120074550A1 LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
有权
导线框架，半导体器件及制造半导体器件的方法
- Patent Title: LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Patent Title (中): 导线框架，半导体器件及制造半导体器件的方法
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Application No.: US13169645Application Date: 2011-06-27
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Publication No.: US20120074550A1Publication Date: 2012-03-29
- Inventor: Takahiro Yurino , Hiroshi Aoki , Tatsuya Takaku
- Applicant: Takahiro Yurino , Hiroshi Aoki , Tatsuya Takaku
- Applicant Address: JP Yokohama-shi
- Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee Address: JP Yokohama-shi
- Priority: JP2010-218853 20100929
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56
Abstract:
A lead frame includes a die stage; an inner lead provided near the die stage; and a bus bar provided between the die stage and the inner lead and supported by a hanging lead, wherein the hanging lead is inclined with respect to the inner lead, and a wire connection face of the bus bar is displaced with respect to a wire connection face of the inner lead in a direction of a frame thickness.
Public/Granted literature
- US08610253B2 Lead frame, semiconductor device, and method of manufacturing semiconductor device Public/Granted day:2013-12-17
Information query
IPC分类:
