Invention Application
- Patent Title: Package For Semiconductor Device Including Guide Rings And Manufacturing Method Of The Same
- Patent Title (中): 包括导环的半导体器件封装及其制造方法
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Application No.: US13188069Application Date: 2011-07-21
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Publication No.: US20120074566A1Publication Date: 2012-03-29
- Inventor: HanShin Youn , Yonghwan Kwon , YoungHoon Ro , Woojae Kim , Sungwoo Park
- Applicant: HanShin Youn , Yonghwan Kwon , YoungHoon Ro , Woojae Kim , Sungwoo Park
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2010-0094617 20100929
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/48

Abstract:
An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.
Public/Granted literature
- US08587108B2 Package for semiconductor device including guide rings and manufacturing method of the same Public/Granted day:2013-11-19
Information query
IPC分类: