发明申请
- 专利标题： SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 具有封装的半导体封装的封装及其制造方法
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申请号： US13314464申请日： 2011-12-08
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公开(公告)号： US20120077311A1公开(公告)日： 2012-03-29
- 发明人: Pyoung-Wan Kim , Teak-Hoon Lee , Chul-Yong Jang
- 申请人： Pyoung-Wan Kim , Teak-Hoon Lee , Chul-Yong Jang
- 优先权： KR2007-0080595 20070810
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
In one embodiment, a semiconductor package includes a first insulating body and a first semiconductor chip having a first active surface and a first back surface opposite the first active surface. The first semiconductor chip is disposed within the first insulating body. The first active surface is exposed by the first insulating body. The first back surface is substantially surrounded by the first insulating body. The semiconductor package includes a post within the first insulating body and adjacent to a side of the first semiconductor chip.
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