Invention Application
- Patent Title: LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME
- Patent Title (中): 发光二极管封装及其制造方法
-
Application No.: US13313886Application Date: 2011-12-07
-
Publication No.: US20120080693A1Publication Date: 2012-04-05
- Inventor: Hung-Yi LIN , Kuan-Jui HUANG , Yen-Ting KUNG , She-Fen TIEN
- Applicant: Hung-Yi LIN , Kuan-Jui HUANG , Yen-Ting KUNG , She-Fen TIEN
- Applicant Address: TW Taoyuan County
- Assignee: TOUCH MICRO-SYSTEM TECHNOLOGY CORPORATION
- Current Assignee: TOUCH MICRO-SYSTEM TECHNOLOGY CORPORATION
- Current Assignee Address: TW Taoyuan County
- Priority: TW097139170 20081013
- Main IPC: H01L33/08
- IPC: H01L33/08
Abstract:
The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.
Information query
IPC分类:
