发明申请
US20120080780A1 SEM ICONDUCTOR DEVICE HAVING PADS AND WHICH MINIMIZES DEFECTS DUE TO BONDING AND PROBING PROCESSES
有权
具有垫片的SEM电极器件和由于结合和探测过程而导致的缺陷最小化
- 专利标题： SEM ICONDUCTOR DEVICE HAVING PADS AND WHICH MINIMIZES DEFECTS DUE TO BONDING AND PROBING PROCESSES
- 专利标题（中）： 具有垫片的SEM电极器件和由于结合和探测过程而导致的缺陷最小化
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申请号： US13323454申请日： 2011-12-12
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公开(公告)号： US20120080780A1公开(公告)日： 2012-04-05
- 发明人: Koji TAKEMURA , Hiroshige Hirano , Masao Takahashi , Hikari Sano , Yutaka Itoh , Koji Koike
- 申请人： Koji TAKEMURA , Hiroshige Hirano , Masao Takahashi , Hikari Sano , Yutaka Itoh , Koji Koike
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JP2005-254852 20050902
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device includes: a semiconductor substrate; a first interlayer insulating film formed over the semiconductor substrate; a pad formed above the first interlayer insulating film; and a plurality of first interconnects spaced apart from each other in a portion of the first interlayer insulating film located below the pad. Below the pad, the first interconnects are formed in quadrangular plan shapes.
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