发明申请
- 专利标题: METHOD FOR BONDING BODIES AND COMPOSITE BODY
- 专利标题(中): 用于接合体和复合体的方法
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申请号: US13248987申请日: 2011-09-29
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公开(公告)号: US20120082823A1公开(公告)日: 2012-04-05
- 发明人: Hin Yiu Anthony CHUNG , Dirk SCHAFFER
- 申请人: Hin Yiu Anthony CHUNG , Dirk SCHAFFER
- 申请人地址: DE Oberkochen
- 专利权人: CARL ZEISS SMT GMBH
- 当前专利权人: CARL ZEISS SMT GMBH
- 当前专利权人地址: DE Oberkochen
- 优先权: DE102010041576.6 20100929
- 主分类号: B32B3/00
- IPC分类号: B32B3/00 ; B32B37/14 ; B32B37/12
摘要:
A method for bonding a first body (2) to a second, panel-shaped body (3) at bonding surfaces (2a, 3a) lying opposite each other, the second body (3) projecting in at least one direction (X) beyond an edge (2′) of the first body (2). The method includes: producing a plurality of spacers (4a to 4e, 4a′ to 4e′) on at least one of the bonding surfaces (2a), applying adhesive (5) into intermediate spaces (6a to 6d) between the spacers beyond an outer spacer (4e, 4e′) as far as an adhesive periphery (5a), which is formed at an edge (2′) of the first body (2), and bonding the bodies (2, 3) by bringing the bonding surfaces (2a, 3a) into contact at the spacers (4a′ to 4e′). A prescribed distance (d) between the adhesive periphery (5a) and the outermost spacer (4e) is set to provide a desired state of deformation of the panel-shaped body (3) after a shrinkage of the applied adhesive (5) (e.g. minimized bending of the body.) In an associated composite body (1), the prescribed distance (d) lies between 20 μm and 250 μm, preferably between 30 μm and 200 μm, in particular between 40 μm and 150 μm.
公开/授权文献
- US08927090B2 Method for bonding bodies and composite body 公开/授权日:2015-01-06
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