发明申请
US20120085750A1 Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device
审中-公开
用于有机基板的覆盖装置，具有覆盖装置的基板以及用于制造覆盖装置的方法
- 专利标题： Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device
- 专利标题（中）： 用于有机基板的覆盖装置，具有覆盖装置的基板以及用于制造覆盖装置的方法
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申请号： US13218691申请日： 2011-08-26
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公开(公告)号： US20120085750A1公开(公告)日： 2012-04-12
- 发明人: Marc Hauer
- 申请人： Marc Hauer
- 申请人地址： CH Bassersdorf
- 专利权人： DYCONEX AG
- 当前专利权人： DYCONEX AG
- 当前专利权人地址： CH Bassersdorf
- 主分类号： B23K13/01
- IPC分类号： B23K13/01 ; B23K1/00 ; B32B37/12
摘要：
A covering device for covering an area of an organic substrate, with a connecting zone between a closure cap and the substrate. It is proposed that the connecting zone includes, at least in certain areas, a heating element for heating the connecting zone during the creation of a connection between the closure cap and the substrate. Also provided is an organic substrate with a covering device and a production method for producing a covering device.
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