发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有间插互连的集成电路包装系统及其制造方法
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申请号： US13324380申请日： 2011-12-13
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公开(公告)号： US20120086115A1公开(公告)日： 2012-04-12
- 发明人: A Leam Choi , Kenny Lee , In Sang Yoon , HanGil Shin
- 申请人： A Leam Choi , Kenny Lee , In Sang Yoon , HanGil Shin
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/56
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure; mounting a first-external-package-component to the routing structure; and forming a first-external-package-encapsulation covering the first-external-package-component.
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