Invention Application
- Patent Title: CIRCUIT FOR THERMAL PROTECTION IN AUDIO POWER AMPLIFIER AND METHOD THEREOF
- Patent Title (中): 音频功率放大器中的热保护电路及其方法
-
Application No.: US13229204Application Date: 2011-09-09
-
Publication No.: US20120086508A1Publication Date: 2012-04-12
- Inventor: Kung-Wang LEE , Tung-Tsai LIAO
- Applicant: Kung-Wang LEE , Tung-Tsai LIAO
- Applicant Address: TW Hsinchu City
- Assignee: GENERALPLUS TECHNOLOGY INC.
- Current Assignee: GENERALPLUS TECHNOLOGY INC.
- Current Assignee Address: TW Hsinchu City
- Priority: TW099134659 20101012
- Main IPC: H03G3/30
- IPC: H03G3/30 ; H03F3/45

Abstract:
The present invention relates to audio amplifier and a method for protecting the audio amplifier. The audio amplifier includes a pre-amp circuit, an output stage power amplifier, a temperature detector and a gain adjusting circuit. The pre-amp circuit receives an audio signal for amplifying the audio signal to generate an amplified audio signal. The output stage power amplifier receives the amplified audio signal to drive a load. The temperature detector is used for detecting a temperature of the output stage power amplifier to output a temperature signal. The gain adjusting circuit adjusts amplitude of the amplified audio signal of the pre-amp circuit according to the temperature signal.
Public/Granted literature
- US08508300B2 Circuit for thermal protection in audio power amplifier and method thereof Public/Granted day:2013-08-13
Information query