发明申请
- 专利标题: Providing Thermal Compensation for Topographic Measurement at an Elevated Temperature Using a Non-Contact Vibration Transducer
- 专利标题(中): 使用非接触式振动传感器在高温下提供用于地形测量的热补偿
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申请号: US12898783申请日: 2010-10-06
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公开(公告)号: US20120086952A1公开(公告)日: 2012-04-12
- 发明人: Arvind K. Sinha
- 申请人: Arvind K. Sinha
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: G01B11/24
- IPC分类号: G01B11/24
摘要:
A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3 (t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3 ( t ) = lim T → ∞ 1 / T ∫ - t / 2 + t / 2 r 2 * ( t ) * r 2 * ( t + Δ t ) t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2 (baseline).
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