发明申请
- 专利标题: SUPERCAPACITOR MODULE
- 专利标题(中): 超级模块
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申请号: US13073378申请日: 2011-03-28
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公开(公告)号: US20120087060A1公开(公告)日: 2012-04-12
- 发明人: Senug Hyun RA , Bae Kyun Kim
- 申请人: Senug Hyun RA , Bae Kyun Kim
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2010-0097758 20101007
- 主分类号: H01G9/155
- IPC分类号: H01G9/155
摘要:
Disclosed herein is a supercapacitor module. The supercapacitor module includes: a plurality of supercapacitors; and a plurality of water cooling jackets having the plurality of supercapacitors inserted therebetween to be stacked and having cooling flow passages protrudedly connected to both sides thereof; wherein the supercapacitors and the cooling jackets are alternately stacked, each of fixing plates is combined with the water cooling jacket at an uppermost layer and the water cooling jacket at a bottommost layer, and the fixing plates are supported by a supporter.
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