发明申请
- 专利标题： SUBSTRATE FOR SUSPENSION
- 专利标题（中）： 暂停基准
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申请号： US13303769申请日： 2011-11-23
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公开(公告)号： US20120090878A1公开(公告)日： 2012-04-19
- 发明人: Yoichi HITOMI , Hiroaki MIYAZAWA , Shinji KUMON , Terutoshi MOMOSE
- 申请人： Yoichi HITOMI , Hiroaki MIYAZAWA , Shinji KUMON , Terutoshi MOMOSE
- 申请人地址： JP Shinjuku-Ku
- 专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人地址： JP Shinjuku-Ku
- 优先权： JP2007-098794 20070404; JP2007-098818 20070404; JP2007-110857 20070419
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
公开/授权文献
- US08399774B2 Substrate for suspension 公开/授权日：2013-03-19
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