Invention Application
- Patent Title: PRINTED CIRCUIT BOARD
- Patent Title (中): 印刷电路板
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Application No.: US12981460Application Date: 2010-12-29
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Publication No.: US20120090884A1Publication Date: 2012-04-19
- Inventor: TSUNG-SHENG HUANG , YING-TSO LAI , CHUN-JEN CHEN , WEI-CHIEH CHOU
- Applicant: TSUNG-SHENG HUANG , YING-TSO LAI , CHUN-JEN CHEN , WEI-CHIEH CHOU
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: TW99135464 20101018
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed circuit board includes a plurality of power layers. Each power layer defining a number of vias arranged in a number of rows. The number of the power layers is N (N>3). The power layers are defined as a 1st, 2nd, . . . , Nth power layer. The vias of the 1st power layer are connected to other power layers by a step-shaped connection means.
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