Invention Application
- Patent Title: ENCLOSURE OF ELECTRONIC DEVICE
- Patent Title (中): 电子设备外壳
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Application No.: US12954661Application Date: 2010-11-25
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Publication No.: US20120090888A1Publication Date: 2012-04-19
- Inventor: ZHENG-HENG SUN
- Applicant: ZHENG-HENG SUN
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: CN201010511554.X 20101019
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An enclosure includes a bracket with a bottom wall, a circuit board mounted to the bottom wall but spaced from the bottom wall, an electronic element mounted to the circuit board, a fan arranged on the bottom wall and facing the space between the circuit board and the bottom wall, and a guiding member attached to the circuit board to block the space between the circuit board and the bottom wall.
Public/Granted literature
- US08373986B2 Enclosure of electronic device Public/Granted day:2013-02-12
Information query