发明申请
US20120091110A1 METHOD OF AND APPARATUS FOR HEAT-TREATING EXPOSED SUBSTRATE 有权
热处理基片的方法与装置

  • 专利标题: METHOD OF AND APPARATUS FOR HEAT-TREATING EXPOSED SUBSTRATE
  • 专利标题(中): 热处理基片的方法与装置
  • 申请号: US13239529
    申请日: 2011-09-22
  • 公开(公告)号: US20120091110A1
    公开(公告)日: 2012-04-19
  • 发明人: Koji KANEYAMA
  • 申请人: Koji KANEYAMA
  • 优先权: JPJP2010-231108 20101014
  • 主分类号: H05B1/00
  • IPC分类号: H05B1/00
METHOD OF AND APPARATUS FOR HEAT-TREATING EXPOSED SUBSTRATE
摘要:
A substrate subjected to a pattern exposure process is transported to a flash bake unit. The flash bake unit performs a post-exposure bake process in which flashes of light are directed from flash lamps onto a surface of the substrate held on an upper surface of a cooling plate to momentarily heat the surface of the substrate, thereby causing crosslinking, deprotection or decomposition and the like of resist resin to proceed by using active species produced in a resist film by a photochemical reaction during the pattern exposure process as an acid catalyst, so that the solubility of only the exposed portion of the resist film in a developing solution is locally changed. The flash heating treatment performed by the irradiation with flashes of light requires extremely short treatment time of not greater than one second. This reduces the diffusion length of acid during the post-exposure bake process.
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