发明申请
- 专利标题: INNER GARNISH ASSEMBLY MODULE SYSTEM
- 专利标题(中): 内部装配模块系统
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申请号: US12666305申请日: 2008-06-30
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公开(公告)号: US20120091746A1公开(公告)日: 2012-04-19
- 发明人: John Zimmer , Rod Bara
- 申请人: John Zimmer , Rod Bara
- 申请人地址: US MI Novi
- 专利权人: Cooper-Standard Automotive Inc.
- 当前专利权人: Cooper-Standard Automotive Inc.
- 当前专利权人地址: US MI Novi
- 国际申请: PCT/US08/68823 WO 20080630
- 主分类号: B60J10/02
- IPC分类号: B60J10/02 ; B23P11/00
摘要:
A one-piece inner garnish assembly module system (MS) joins an inner garnish molding (IG), primary seal (PS), glass run (GR), and inner beltline weatherstrip (IB) into a single component prior to installation of the module system on a vehicle. The garnish is secured to the glass run along the A and B pillars, and the interconnecting header portion of a vehicle door. In addition, the primary seal is operatively associated or secured to the garnish, and may be pin-mounted to the door, or mechanically connected, and/or adhesively secured to the door.
公开/授权文献
- US08840170B2 Inner garnish assembly module system 公开/授权日:2014-09-23
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