发明申请
- 专利标题: ELECTRONIC DEVICE ENCLOSURE
- 专利标题(中): 电子设备外壳
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申请号: US13163755申请日: 2011-06-20
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公开(公告)号: US20120091868A1公开(公告)日: 2012-04-19
- 发明人: LIANG-CHIN WANG , JIAN HU , YU-MING XIAO , ZAN LI
- 申请人: LIANG-CHIN WANG , JIAN HU , YU-MING XIAO , ZAN LI
- 申请人地址: TW Tu-Cheng CN Shenzhen City
- 专利权人: HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- 当前专利权人: HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- 当前专利权人地址: TW Tu-Cheng CN Shenzhen City
- 优先权: CN201010509997.5 20101015
- 主分类号: H05K5/02
- IPC分类号: H05K5/02
摘要:
An electronic device enclosure comprises a securing plate and a bracket adapted to receive an I/O connector therein. The bracket comprises a first resilient piece, a second resilient piece, a first retaining piece and a second retaining piece. The bracket is capable of securing to the front wall in a first position, where the first resilient piece and the first retaining piece abut two opposite surfaces of the securing plate, and a second position, where the second resilient piece and the second retaining piece abut the two opposite surfaces of the securing plate.
公开/授权文献
- US08408662B2 Electronic device enclosure 公开/授权日:2013-04-02
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