发明申请
- 专利标题： ANTENNA STRUCTURE USING MULTILAYERED SUBSTRATE
- 专利标题（中）： 天线结构使用多层基板
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申请号： US13271298申请日： 2011-10-12
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公开(公告)号： US20120092219A1公开(公告)日： 2012-04-19
- 发明人: Dong-Young KIM
- 申请人： Dong-Young KIM
- 申请人地址： KR Daejeon
- 专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人地址： KR Daejeon
- 优先权： KR10-2010-0099753 20101013; KR10-2011-0033745 20110412
- 主分类号： H01Q1/38
- IPC分类号： H01Q1/38
摘要：
Disclosed is an antenna structure using a multilayered substrate, including: a multilayered substrate having a multilayered structure; a dielectric resonator formed in the multilayered substrate; a metal surface formed on the top surface of the multilayered substrate except for an upper area of the dielectric resonator; a ground surface formed on a layer border where the bottom surface of dielectric resonator is positioned in the multilayered substrate and including at least one aperture; and a feed line formed on the bottom surface of the multilayered substrate and transferring energy through the aperture.
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