Invention Application
US20120093907A1 COMPOSITE OF SILVER NANOPARTICLE AND LAYERED INORGANIC CLAY FOR INHIBITING GROWTH OF SILVER-RESISTANT BACTERIA
审中-公开
银纳米复合材料和层状无机粘土抑制耐银菌生长的复合材料
- Patent Title: COMPOSITE OF SILVER NANOPARTICLE AND LAYERED INORGANIC CLAY FOR INHIBITING GROWTH OF SILVER-RESISTANT BACTERIA
- Patent Title (中): 银纳米复合材料和层状无机粘土抑制耐银菌生长的复合材料
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Application No.: US13102017Application Date: 2011-05-05
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Publication No.: US20120093907A1Publication Date: 2012-04-19
- Inventor: Jiang-Jen Lin , Hong-Lin Su , I-Chuan Pao , Siou-Hong Lin
- Applicant: Jiang-Jen Lin , Hong-Lin Su , I-Chuan Pao , Siou-Hong Lin
- Applicant Address: TW Taipei
- Assignee: NATIONAL TAIWAN UNIVERSITY
- Current Assignee: NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Taipei
- Priority: TW099135333 20101015
- Main IPC: A01N25/26
- IPC: A01N25/26 ; A01P15/00 ; A01N59/16 ; B82Y5/00
Abstract:
The present invention provides a composite of spherical silver nanoparticles and layered inorganic clay. This composite can effectively inhibit the growth of silver-resistant bacteria. The layered inorganic clay serves as carriers of the silver nanoparticles and disperses them. The composite has a particle size of about 5 nm to 100 nm. The silver nanoparticles can be dispersed in an organic solvent or water.
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