发明申请
- 专利标题: HOUSING FOR ELECTRONIC DEVICE AND METHOD FOR MAKING SAME
- 专利标题(中): 用于电子设备的外壳及其制造方法
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申请号: US13051035申请日: 2011-03-18
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公开(公告)号: US20120094046A1公开(公告)日: 2012-04-19
- 发明人: SHI-FENG WANG , KUAN-HUNG CHEN
- 申请人: SHI-FENG WANG , KUAN-HUNG CHEN
- 申请人地址: HK Kowloon CN ShenZhen City
- 专利权人: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- 当前专利权人: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: HK Kowloon CN ShenZhen City
- 优先权: CN201010507128.9 20101014
- 主分类号: B32B1/02
- IPC分类号: B32B1/02 ; C23F1/32 ; C23F1/00 ; C23F1/16 ; C23C14/34 ; H05K13/00
摘要:
A method for making a housing for an electronic device, including steps of: providing a substrate; forming a base paint layer on an outer surface of the substrate; forming a metallic layer with a metallic appearance on the base paint layer; forming a chemical resistant protective coating on the metallic layer, the protective coating having substantially the same shape as desired patterns; chemically removing the metallic layer not covered by the protective coat, the remainder of the metallic layer forming desirable patterns; and removing the protective coat. A housing made by the present method is provided.
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