发明申请
- 专利标题： Semiconductor device and method of manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US13317018申请日： 2011-10-07
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公开(公告)号： US20120098115A1公开(公告)日： 2012-04-26
- 发明人: Yuji Watanabe
- 申请人： Yuji Watanabe
- 申请人地址： JP Tokyo
- 专利权人： Elpida Memory, Inc.
- 当前专利权人： Elpida Memory, Inc.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-238648 20101025
- 主分类号： H01L25/07
- IPC分类号： H01L25/07 ; H01L23/36
摘要：
A semiconductor device has a substrate, a semiconductor chip mounted on the substrate, an encapsulating body encapsulating the semiconductor chip on the substrate, and a plurality of heat sink plates embedded in the encapsulating body so as to have a surface that is exposed to an exterior of the encapsulating body and positioned on the same plane. The heat sink plates are spaced from each other.
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