Invention Application
- Patent Title: SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Patent Title (中): 半导体器件制造方法和制造设备
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Application No.: US13278164Application Date: 2011-10-20
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Publication No.: US20120100639A1Publication Date: 2012-04-26
- Inventor: Yuichi URANO
- Applicant: Yuichi URANO
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2010-236205 20101021
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/30
Abstract:
A semiconductor device manufacturing method and manufacturing apparatus with which it is possible, when a wafer has a warp, to effectively peel off an ultraviolet peelable tape with ultraviolet irradiation of a short duration. Even when a wafer has a warp, by correcting the warp of the wafer with an ultraviolet transmitting plate, and uniformly irradiating an ultraviolet peelable tape attached to the wafer with ultraviolet light, it is possible to reduce a distance between an ultraviolet light source and the ultraviolet peelable tape. Also, by blocking heat from the ultraviolet light source with the ultraviolet transmitting plate, it is possible to suppress a rise in temperature of the wafer. As a result of this, it is possible to effectively peel the ultraviolet peelable tape from the wafer with ultraviolet irradiation of a short duration without any adhesive residue remaining.
Public/Granted literature
- US08518804B2 Semiconductor device manufacturing method and manufacturing apparatus Public/Granted day:2013-08-27
Information query
IPC分类:
