Provided herewith a socket connector adapted to be mounted on a substrate having a conductive element is provided, and comprises an insulative housing, the housing having an exterior side adapted to face the substrate. A stamped contact is formed from a sheet of conductive material and is adapted to mate with a conductive component and extending substantially to the exterior side of the housing. The contact has a connection portion and wherein a substantially dried preparation of oxidation retarding and solder affinity deployed on the terminal portion before the contact assembled into the connector. The connector further includes a body of reflowable, electrically conductive material associated adjacent to the connection portion adjacent the exterior side of the housing.