Invention Application
- Patent Title: HIGH-SPEED CARD CABLE
- Patent Title (中): 高速卡电缆
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Application No.: US13122961Application Date: 2010-11-02
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Publication No.: US20120103657A1Publication Date: 2012-05-03
- Inventor: Kenichi Fuse
- Applicant: Kenichi Fuse
- Applicant Address: US DE Wilmington
- Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee Address: US DE Wilmington
- International Application: PCT/US10/55063 WO 20101102
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01R43/00

Abstract:
Techniques described herein generally relate to ground planes. In some examples, an electrical cable is described that can include multiple signal lines. The multiple signal lines can be arranged to extend along a length of the electrical cable. A ground plane can be spaced apart from the multiple signal lines. The ground plane can include a mesh structure and an electrically conductive layer that is arranged to coat the mesh structure. The mesh structure can include multiple resin fibers.
Public/Granted literature
- US08907220B2 High-speed card cable Public/Granted day:2014-12-09
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