An electronic device includes a first substrate on which a thin-film circuit layer is provided at a side of a first face, a second substrate on which a wiring layer is provided, and an isotropic conductive material which electrically connects a terminal portion of the thin-film circuit layer and the wiring layer. In the electronic device, the conductive material is in film-formed from on the terminal portion to on the wiring layer. When the terminal portion of the thin-film circuit layer and the wiring layer of a connection substrate are electrically connected to each other, the terminal portion is not required to be excessively pressurized and heated. Therefore, the terminal portion can be prevented from being damaged.