A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.