Invention Application
US20120103682A1 LEAD FRAME HAVING METAL CUP WITH ENLARGED HEAT-DISSPIATION AREA
审中-公开
带有放大加热区域的金属杯的引导框架
- Patent Title: LEAD FRAME HAVING METAL CUP WITH ENLARGED HEAT-DISSPIATION AREA
- Patent Title (中): 带有放大加热区域的金属杯的引导框架
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Application No.: US13241288Application Date: 2011-09-23
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Publication No.: US20120103682A1Publication Date: 2012-05-03
- Inventor: YEN-CHIH CHANG , CHIH-PI CHENG
- Applicant: YEN-CHIH CHANG , CHIH-PI CHENG
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Priority: TW099137636 20101102
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H05K1/18
Abstract:
A lead frame includes an insulative housing defining a cavity, a plurality of leads mounted with the housing and a metal cup mounted within the housing. Each lead includes contacting section exposed in the cavity. The metal cup includes a bottom plate and an inclined cup wall. The bottom plate is formed with a flange extending outwardly therefrom such that a slot is defined between the flange and the cup wall to receive the resin material of the housing.
Information query
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