Invention Application
- Patent Title: WIRING STRUCTURE, CABLE, AND METHOD OF MANUFACTURING WIRING STRUCTURE
- Patent Title (中): 接线结构,电缆和制造接线结构的方法
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Application No.: US13382504Application Date: 2010-04-28
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Publication No.: US20120103683A1Publication Date: 2012-05-03
- Inventor: Hisashi Ishida
- Applicant: Hisashi Ishida
- Priority: JP2009-167587 20090716
- International Application: PCT/JP2010/003065 WO 20100428
- Main IPC: H02G3/00
- IPC: H02G3/00 ; D04C1/06

Abstract:
The present invention provides a wiring structure that easily achieves a wiring part having a three-dimensional shape with high connection reliability and high signal quality. A wiring structure (10) according to the present invention includes one or a plurality of cables (18), a fiber (12) forming a mesh-like braiding fabric together with the cable (18), cable connectors (13, 17) formed at ends of the cable (18), and modules (14, 15) connected to the cable connectors (13, 17), the modules receiving or outputting signals through the cable.
Public/Granted literature
- US09320141B2 Wiring structure, cable, and method of manufacturing wiring structure Public/Granted day:2016-04-19
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