发明申请
- 专利标题： METHOD FOR MANUFACTURING LEADFRAME, PACKAGING METHOD FOR USING THE LEADFRAME AND SEMICONDUCTOR PACKAGE PRODUCT
- 专利标题（中）： 制造铅笔的方法，使用铅笔和半导体包装产品的包装方法
-
申请号： US13346641申请日： 2012-01-09
-
公开(公告)号： US20120104588A1公开(公告)日： 2012-05-03
- 发明人: Nan-Jang Chen , Hong-Chin Lin
- 申请人： Nan-Jang Chen , Hong-Chin Lin
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.