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发明申请
US20120107552A1 Chip Attachment Layer Having Traverse-Aligned Conductive Filler Particles 审中-公开
具有横向对准导电填料颗粒的芯片附着层

Chip Attachment Layer Having Traverse-Aligned Conductive Filler Particles
摘要：
A method for conductively attaching a workpiece (110) onto a substrate (101). Spreading a layer of an adhesive polymeric compound (130) over the first surface (101a) of the substrate, the compound including a suspension of electrically and thermally conductive first particles (140) intermixed with a suspension of ferromagnetic surfactant-coated second particles (141). Applying an external magnetic field (401) to the layer, the field oriented normal to the first surface and capable of arraying the ferromagnetic particles in lines, and, by causality, aligning the conductive particles in chains normal to the first surface. Orienting the second surface (110a) of the workpiece parallel to the first substrate surface (101a) and bringing the aligned conductive particle chains (140) in contact with the first and second surfaces by pressing the workpiece onto the layer and piercing the chain ends to touch the first and second surfaces.
摘要（中）：

一种用于将工件（110）导电地附接到基板（101）上的方法。 在衬底的第一表面（101a）上铺展一层粘合的聚合化合物（130），该化合物包括导电和导热的第一颗粒（140）与铁磁表面活性剂涂覆的第二颗粒（141）的悬浮液混合的悬浮液 ）。 将外部磁场（401）施加到该层，该场与第一表面垂直并且能够排列铁磁颗粒，并且通过因果关系将导电颗粒与第一表面垂直的链对准。 使工件的第二表面（110a）平行于第一基板表面（101a）定向，并且使对准的导电粒子链（140）通过将工件压入该层并将链端刺穿到第二表面 触摸第一和第二表面。

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