发明申请
- 专利标题: MAGNETIC TUNNEL JUNCTION DEVICE AND FABRICATION
- 专利标题(中): 磁性隧道连接装置和制造
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申请号: US13349633申请日: 2012-01-13
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公开(公告)号: US20120107966A1公开(公告)日: 2012-05-03
- 发明人: Kangho Lee , Xiaochun Zhu , Xia Li , Seung H. Kang
- 申请人: Kangho Lee , Xiaochun Zhu , Xia Li , Seung H. Kang
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; G06F9/45
摘要:
A magnetic tunneling junction device and fabrication method is disclosed. In a particular embodiment, the method includes depositing a capping material on a free layer of a magnetic tunneling junction structure to form the capping layer and oxidizing a portion of the capping material to form a layer of oxidized material.
公开/授权文献
- US08580583B2 Magnetic tunnel junction device and fabrication 公开/授权日:2013-11-12
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