Invention Application
US20120113606A1 Bendable Luminous Modules and Method for Producing Bendable Luminous Modules 有权
可弯曲发光模块和生产弯曲发光模块的方法

  • Patent Title: Bendable Luminous Modules and Method for Producing Bendable Luminous Modules
  • Patent Title (中): 可弯曲发光模块和生产弯曲发光模块的方法
  • Application No.: US13384541
    Application Date: 2010-06-16
  • Publication No.: US20120113606A1
    Publication Date: 2012-05-10
  • Inventor: Thomas Preuschl
  • Applicant: Thomas Preuschl
  • Priority: DE102009032984.6 20090714
  • International Application: PCT/EP2010/058475 WO 20100616
  • Main IPC: H05K5/02
  • IPC: H05K5/02 H05K13/00
Bendable Luminous Modules and Method for Producing Bendable Luminous Modules
Abstract:
A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).
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