发明申请
- 专利标题: METHOD OF CONTACT COATING A MICRONEEDLE ARRAY
- 专利标题(中): 接触涂层麦克风阵列的方法
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申请号: US13290610申请日: 2011-11-07
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公开(公告)号: US20120114857A1公开(公告)日: 2012-05-10
- 发明人: Choi Hye-Ok , Gordon P. Knutson , Moses M. David
- 申请人: Choi Hye-Ok , Gordon P. Knutson , Moses M. David
- 专利权人: 3M Innovative Properties Company
- 当前专利权人: 3M Innovative Properties Company
- 主分类号: B05D7/00
- IPC分类号: B05D7/00 ; B05D3/00
摘要:
A method of coating a microneedle array by applying a coating fluid using a flexible film in a brush-like manner. A method of coating a microneedle array comprising: providing a microneedle array having a substrate and a plurality of microneedles; providing a flexible film; providing a coating solution comprising a carrier fluid and a coating material; applying the coating solution onto a first major surface of the flexible film; performing a transfer step of bringing the first major surface of the flexible film into contact with the microneedles and removing the flexible film from contact with the microneedles; and allowing the carrier fluid to evaporate.
公开/授权文献
- US08414959B2 Method of contact coating a microneedle array 公开/授权日:2013-04-09
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