发明申请
US20120115305A1 METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PACKAGING
有权
用于在半导体包装中的波形粘结的方法和结构
- 专利标题： METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PACKAGING
- 专利标题（中）： 用于在半导体包装中的波形粘结的方法和结构
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申请号： US12943281申请日： 2010-11-10
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公开(公告)号： US20120115305A1公开(公告)日： 2012-05-10
- 发明人: Jung-Huei PENG , Hsin-Ting HUANG , Yao-Te HUANG , Shang-Ying TSAI , Ping-Yin LIU
- 申请人： Jung-Huei PENG , Hsin-Ting HUANG , Yao-Te HUANG , Shang-Ying TSAI , Ping-Yin LIU
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
A method for wafer to wafer bonding in semiconductor packaging provides for roughening the bonding surfaces in one embodiment. Also provided is a method for passivating the bonding surfaces with a lower melting point material that becomes forced away from the bonding interface during bonding. Also provided is a method for forming an eutectic at the bonding interface to reduce the impact of any native oxide formation at the bonding interface.